MIL-PRF-83531C
TABLE I. Qualification inspection.
Inspection
Requirement
Test
Number of
Number of
paragraph
method
sample
allowable
paragraph
units
failures
Q-I
Dimensions
3.5.1
4.6.2
Thermal shock (50 cycles)
3.6
4.6.4
22
2
Seal
3.7
4.6.5
Electrical characteristics
3.8
4.6.6
Visual inspections 1/
3.5.2
4.6.3
Q-II
Moisture resistance
3.11
4.6.9
Salt spray (corrosion)
3.12
4.6.10
6
0
(metal cases only)
Vibration
3.13
4.6.11
Shock
3.14
4.6.12
Electrical characteristics
3.8
4.6.6
Visual inspection 1/
3.5.2
4.6.3
Q-III
Life
3.15
4.6.13
Terminal strength
3.16
4.6.14
Fungus 2/
3.17
4.6.15
Electrical characteristics
3.8
4.6.6
6
0
Dielectric withstanding
3.18
4.6.16
voltage at reduced
barometric pressure
Visual inspection 1/
3.5.2
4.6.3
Q-IV
Resistance to soldering heat
3.19
4.6.17
4
0
Flammability
3.20
4.6.18
Q-V
Resistance to solvents
3.9
4.6.7
4
0
Solderability
3.10
4.6.8
1/ The "JAN" or "J" marking and PIN are not required on qualification samples.
2/ The fungus test shall not be performed if the manufacturer provides certification that all
external materials are non-nutrient to fungus growth or suitably treated to retard fungus
growth.
3.4.5.2 Meniscus. Terminals shall be free of case meniscus or other foreign material and shall be
solderable for a minimum of .010 inch (0.25 mm) above the seating plane of the delay line.
5
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