MIL-DTL-55422B
b.
Magnitude of test voltage: 3,500 volts (RMS) at sea level; 1,500 volts (RMS) at 50,000 feet; 750 volts
(RMS) at 70,000 feet. Voltage shall be applied instantaneously.
c.
Nature of potential: Alternating current.
d.
Points of application of test voltage: As specified on figure in specification sheets.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel
need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are
maintained by the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or
within the military service's system commands. Packaging data retrieval is available from the managing Military
Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible
packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use.
6.1.1 General. Electrical clips covered by this specification are designed for the use with electron tubes. Their
principal areas of application are aircraft, missiles, spacecraft, and ground support equipment. This does not
preclude the use of these clips in other military applications.
6.2 Acquisition requirements. Acquisition document s should specify the following:
a. Title, number, and date of the specification.
6.2.1 Items covered by specification sheets. Acquisition documents for gaskets covered by MIL-DTL-55422
specification sheets should specifying the following:
a.
Title, number, and date of this specification.
Title, number, and date of the applicable specification sheet and the complete PIN (see 1.2.1 and 3.1).
b.
Special or additional marking (if required) (see 5.1).
c.
6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin
whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture
and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied
over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass,
have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545
(Standard Specification for Electrodeposited Coatings of Tin).
6.4 PIN. This specification requires a PIN that describes codification or classification and appropriate references
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