MIL-STD-1276 Leads For Electronic Component PartsThis standard establishes the method of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition of the plating used therewith, and the sizes of wire and flat wire ribbon leads on electronic and electrical parts when they are to be soldered or welded during assembly in equipment.

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MIL-STD-1276H

CONTENTS

PARAGRAPH PAGE FORWARD…………………………………………………………………………………………………… ii

2. APPLICABLE DOCUMENTS ............................................................................................................ 3

2.1	General...............................................................................................................................	3
2.2	Government documents......................................................................................................	3
2.2.1	Specifications, standards, and handbooks..........................................................................	3
2.3.	Non-Government publications.............................................................................................	3
2.4.	Order of precedence...........................................................................................................	4

3. DEFINITIONS.................................................................................................................................... 5

3.1 Definitions ........................................................................................................................... 5

4. GENERAL REQUIREMENTS ........................................................................................................... 6

4.1	Preferred methods of assembly ..........................................................................................	6
4.2	Solderability ........................................................................................................................	7
4.3	Thickness............................................................................................................................	7
4.4	Adhesion.............................................................................................................................	7
4.5	Porosity...............................................................................................................................	7
4.6	Recycled, recovered, or environmentally preferable materials............................................	7
4.7	Pure tin …………………………………………………………………………………………….	7
4.8	Workmanship in finishes .....................................................................................................	7

5. DETAILED REQUIREMENTS ........................................................................................................... 8

5.1 Composition........................................................................................................................ 8

5.2 Final finish........................................................................................................................... 9

5.2.1 Underplating ....................................................................................................................... 10

5.2.1.1 Gold plating......................................................................................................................... 10

5.2.1.2 Composition F, G, and K..................................................................................................... 10

5.2.1.3 Hot solder dip...................................................................................................................... 10

5.2.1.4 Composition A, B, J, and X ................................................................................................. 10

6. NOTES ............................................................................................................................................ 11

6.1 Intended use ....................................................................................................................... 11

6.2 Precaution........................................................................................................................... 11

6.3 Removal of gold plating before soldering............................................................................ 11

6.4 Passive nickel ..................................................................................................................... 11

6.5 Cross reference .................................................................................................................. 11

6.6 Environmentally preferable material.................................................................................... 12

6.7 Cleanliness ......................................................................................................................... 12

6.8 Supersession data .............................................................................................................. 12

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