MIL-STD-1276 Leads For Electronic Component PartsThis standard establishes the method of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition of the plating used therewith, and the sizes of wire and flat wire ribbon leads on electronic and electrical parts when they are to be soldered or welded during assembly in equipment.

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MIL-STD-1276H

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3, 4, and 5 of this standard. This section does not include documents cited in other sections of this standard or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3, 4, and 5 of this standard, whether or not they are listed.

2.2 Government documents.

2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-DTL-45204 - Gold Plating, Electrodeposited

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-202 - Test Methods for Electronic and Electronic and Electrical Component Parts. MIL-STD-750 - Test Methods for Semiconductor Devices.

MIL-STD-883 - Test Methods and Procedures for Microelectronics.

(Copies of these documents are available online at https://assist.dla.mil/ or from the Standardization Document

Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

IPC - ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES

J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.

(Copies of these documents are available online at https://www.ipc.org/ or from the, IPC - ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES, 3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 60015-1249.)