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MIL-STD-1276 Leads For Electronic Component PartsThis standard establishes the method of identifying, specifying, and limiting to a minimum the combinations of basic materials, the thickness and composition of the plating used therewith, and the sizes of wire and flat wire ribbon leads on electronic and electrical parts when they are to be soldered or welded during assembly in equipment.

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MIL-STD-1276H

TABLE I. Nominal size (for information only).

Wire size

AWG (B and S)

Diameter in inches

Diameter in millimeters

.289

.257

.229

.204

.181

.162

.144

.128

.114

.101

.090

.080

.072

.064

.057

.050

.045

.040

.035

.032

.028

.025

.022

.020

.017

.015

.014

.012

.011

.010

.008

.007

.006

.005

.004

.003

7.34

6.53

5.82

5.18

4.60

4.11

3.65

3.25

2.90

2.57

2.29

2.03

1.83

1.63

1.45

1.27

1.14

1.02

0.89

0.81

0.71

0.64

0.56

0.51

0.43

0.38

0.36

0.30

0.28

0.25

0.20

0.18

0.15

0.13

0.10

0.08